南极熊导读：随着工程师们不断寻求提高工艺可靠性并减少缺陷，仿真正成为控制金属增材制造复杂物理过程的重要工具。 FlowScience 的 Garrett Clyma。摄影：MichaelPetch。 南极熊获悉，在2025年AMUG大会上，FlowScience, Inc.的计算流体动力学 (CFD) 工程师Garrett Clyma概述了熔 ...

Santa Fe, October 29, 2020 – Flow Science has launched FLOW-3D HYDRO, a CFD modeling solution for the civil and environmental engineering industry. FLOW-3D HYDRO features a water-focused user ...

The 2017 FLOW-3D Americas Users Conference has issued its Call for Abstracts. The event takes place Sept. 20-21 in Santa Fe, NM. The call for abstracts for is now open. Share your experiences, present ...

From Black Box to Full Transparency and Control, New Product Enables a Pathway to Migrate Additive Manufacturing Knowledge to Velo3D’s Fully Integrated Solution and Print Process Optimization FREMONT, ...

Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...

HSINCHU, Taiwan & SAN JOSE, Calif.--(BUSINESS WIRE)--United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, and Cadence Design Systems, Inc.

No refutations from CERN, IEEE, CPRIT, PAS, or scientists—despite press releases reaching over 300 million people worldwide. 3D-Flow & 3D-CBS can save billions of euro and halve cancer deaths.

(Nanowerk News) Imec presents a via-middle through-Si-via (TSV) approach to 3D stacking. This method is new to industry as it allows to 'reveal' TSV contacts by using a Si-etch process. The process ...

A team of researchers has developed a theory to explain how hydrodynamic electron flow could occur in 3D materials and observed it for the first time using a new imaging technique. Electrons flow ...