The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...

One of the hardest aspects of game design to define is good level design. There is no set formula for organizing a layout, sculpting interrelated structures and objects in an environment, using ...

As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...

3D Visualization Lecturers: 3D Visualization professionals are invited to RIT to lead lectures, discussions, and demos that give you an informed industry perspective. Industry Networking: Take part in ...

Join members of the development team for a look at Operencia from a Design and 3D level building perspective as they discuss how a level comes to life, and more. Operencia: The Stolen Sun will be ...

The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...

Yield and cost have always been critical factors for both manufacturers and designers of semiconductor products. It is a continuous challenge to meet targets of both yield and cost, due to new device ...