October 13, 2013. Delft University of Technology (TU Delft) and nanoelectronics research center imec have presented 3D-COSTAR, a new test-flow cost-modeling tool for 2.5/3D stacked integrated circuits ...

Improved testability, coupled with more tests at more insertion points, are emerging as key strategies for creating reliable, heterogeneous 2.5D and 3D designs with sufficient yield. “With chiplets, ...

A desire for a simpler, cheaper way to do common laboratory tests for medical diagnoses and to avoid 'washing the dishes' led researchers to develop a new technology that reduces cost and time. The 3D ...

The industry is investing in more precise and productive inspection and testing to enable advanced packages and eventually, 3D ICs. The next generations of aerospace, automotive, smartphone, and ...