Have you ever felt that reality is deeper than what meets the eye? That perhaps our everyday experience is just the surface of something far more expansive? You're not alone. As humanity collectively ...

High-performance computing, 6G communication, autonomous vehicle chips, and consumer electronics are all key markets that benefit from advancing semiconductor packaging. IDTechEx's report, "Advanced ...

中商产业研究院数据显示，2025年中国先进封装渗透率预计升至41%，相比2020年提升近20个百分点。Yole Group则给出全球市场坐标：2024年规模460亿美元，2030年将突破794亿美元，年复合增速9.5%，AI、HPC、汽车成为“三驾马车”。先进封装已从传统“后道配角”升级为 ...

DEAR BONNIE: I have been hearing about moving into a 5D world of consciousness, and I am not sure exactly what that entails, but I am noticing a difference in my attitude about what is acceptable and ...

9月26日13:30-16:30，主办单位联合厦门大学共同组织「金刚石闭门研讨会」，仅限30个名额，诚邀金刚石、微通道散热、均热板、冷板、液冷企业、终端用户共同参与！如有意向请联系会务组（Mia Wang 18158256081，微信同号）。 赵毅，珠海硅芯科技有限公司创始人 ...

Stacking dies will dramatically improve performance, but it’s still a work in progress.

Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to accelerate design cycles and ...