达尔文3代类脑计算芯片！2.5D 封装 + 国产晶圆基板工艺！ 浙大 “悟空” 出世：晶圆级集成、达尔文 3 芯片立大功 8 月 2 日，浙江大学脑机智能全国重点实验室重磅发布最新研制的新一代神经拟态类脑计算机 —Darwin Monkey（“悟空”）。这是国际上首台神经元 ...

SAN JOSE, California – Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to ...

Engineers in Germany have developed a new compact imaging system that’s capable of recording hyperspectral images in five dimensions. This 5D process means capturing data related to multiple ...

Several companies are racing each other to develop a new class of 2.5D and 3D packages based on various next-generation interconnect technologies. Intel, TSMC and others are exploring or developing ...

Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it will provide turnkey semiconductor solutions using the 2-nanometer (nm) foundry process and the ...

TL;DR: Broadcom has introduced its 3.5D eXtreme Dimension System in Package (XDSiP) technology, enabling AI customers to develop advanced custom accelerators. This platform integrates over 6000 mm² of ...

中商产业研究院数据显示，2025年中国先进封装渗透率预计升至41%，相比2020年提升近20个百分点。Yole Group则给出全球市场坐标：2024年规模460亿美元，2030年将突破794亿美元，年复合增速9.5%，AI、HPC、汽车成为“三驾马车”。先进封装已从传统“后道配角”升级为 ...

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it will provide turnkey semiconductor solutions using the ...

OSATs and ATE vendors are making progress in determining what works and what doesn’t in 2.5D packaging, expanding their knowledge base as this evolves into a mainstream technology. Most experts ...

"Interestingly, we were able to grow organoid cells using techniques just shy of the traditional, complete 3D bioprinting process - a sort of 2.5D process - while producing most of the 3D organoid ...

Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to accelerate design cycles and ...