PALO ALTO, Calif., Dec. 05, 2024 (GLOBE NEWSWIRE) -- Broadcom Inc. (AVGO) today announced the availability of its 3.5D eXtreme Dimension System in Package (XDSiP™) platform technology, enabling ...

Broadcom Inc. today detailed a new chip packaging technology, XDSiP, that makes it possible to create processors by stacking multiple silicon dies atop another. XDSiP is short for eXtreme Dimension ...

Broadcom Inc. has unveiled its revolutionary 3.5D eXtreme Dimension System in Package (XDSiP) platform, designed to empower consumer AI companies in developing advanced custom accelerators, or XPUs.

Apple Inc.’s upcoming M5 line of Mac chips will be made using Taiwan Semiconductor Manufacturing Co.’s three-nanometer N3P process, 9to5Mac reported today. The publication attributed the information ...

Broadcom (AVGO) announced the availability of its 3.5D eXtreme Dimension System in Package platform technology, enabling consumer AI customers to develop next-generation custom accelerators. The 3.5D ...

SPhotonix is working towards commercializing its 5D optical "memory crystal" technology that uses lasers to write nanoscale data into durable fused‑silica glass. One 5‑inch disc can hold 360TB. The ...

We recently compiled a list of the 10 Buzzing AI Stocks Making Headlines. In this article, we are going to take a look at where Broadcom Inc. (NASDAQ:AVGO) stands against the other buzzing AI stocks.

Glass nanostructures etched using high-intensity femtosecond laser pulses promise to keep vast quantities of data safe for billions of years, describe Peter Kazansky, Ausra Cerkauskaite and Rokas ...

"Moreover, we actively facilitate the cooperation between a number of respected robotic companies in Russia with leading associations and companies in Singapore," Mikhail Bondarenko noted BANGKOK, ...