(Nanowerk Spotlight) The development of flexible electronic devices has faced a persistent materials science challenge: how to securely attach rigid metal components to flexible polymer surfaces.

Photosensitive polymer films are commonly utilized as a dielectric layer in microelectronics packaging. The performance of the organic film is determined by the adhesion quality between the polymer ...

(a) The entire structure and cross section of the macroscopic core-shell adhesives; (b) The section morphology of the core-shell adhesives; (c) A brief description of the mechanism of the core-shell ...

A team led by Pei-Yi Wu and Sheng-Tong Sun at Donghua University reported a strong hydrogel fiber material with water-induced adhesion properties that resolves the structural contradiction of ...

A recent study published in Engineering presents a significant development in dry adhesive technology. Researchers from Xi’an Jiaotong University, including Duorui Wang, Hongmiao Tian, Jinyou Shao, ...