As device scaling slows down, a key system functional integration technology is emerging: heterogeneous integration (HI). It leverages advanced packaging technology to achieve higher functional ...

Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a significant shift in system integration strategies. Industry analyses show 3D IC ...

As system-on-chip (SoC) complexity grows, so does the necessity for products that seamlessly connect IP and streamline integration processes, minimize manual errors, and enhance productivity. The ...

The considerable growth of the number of logical cores in a chip increases the number of networks-on-chip (NoCs) per system-on-chip (SoC), fueling design complexity. Demand is on the rise for better ...

WASHINGTON — The Army is moving toward a future where soldier formations will be more efficient and lethal thanks to the integration of advanced technology both on the ground and in the air, according ...

To continue reading this content, please enable JavaScript in your browser settings and refresh this page. The union tells members the companies are interested in ...