WENZHOU, ZHEJIANG PROVINCE, CHINA, January 19, 2026 /EINPresswire.com/ -- As the global pharmaceutical and healthcare ...

CEO Bill Miller highlighted 2024 as a successful year with milestones such as shipping an LSA system for 2-nanometer gate all-around logic chips and an agreement to ship an LSA evaluation to a second ...

Leading expert to also present session on advanced packing materials for the next-generation automotive industry ...

With an advanced semiconductor testing and packaging plant to be put into operation in 2027, Vietnam will be able to step further into the global value chain.

Richard P. Wallace, CEO, outlined that "KLA's results were strong across the board, and we were at or above the high end of our guidance ranges. Specifically, revenue was $3.175 billion. Non-GAAP ...

Lam Research Corporation LRCX sees advanced packaging as a major growth driver for its Systems segment sales in fiscal 2026. The company crossed $1 billion in advanced packaging-related revenues in ...

Diamond Quanta today announced Adamantine Thermal(TM), an engineered-diamond thermal platform designed for integration into advanced packaging workflows and heterogeneous semiconductor systems. The ...

A new technical paper titled “Thermal stability enhancement of low temperature Cu-Cu bonding using metal passivation ...

GlobalFoundries plans a new advanced packaging center in New York for U.S.-made semiconductor chips, supported by state and federal funding. GlobalFoundries has announced plans to establish a new ...

GF will make an initial investment of $575M, create 100 jobs at the New York Advanced Packaging and Photonics Center in Malta. G lobalFoundries (GF) plans to create a new center for advanced packaging ...