Designing energy-efficient systems that meet the high bandwidth demands of high-performance computing (HPC) involves key trends in silicon technology: increasing transistor density, enhancing memory ...

A new technical paper titled “Fault-marking: defect-pattern leveraged inherent fingerprinting of advanced IC package with thermoreflectance imaging” was published by researchers at University of ...

The rapid evolution of heterogeneous integration and packaging technologies is reshaping the landscape of electronic design by enabling the assembly of diverse, specialised chip components into ...

Elephantech, a Tokyo-based printed electronics manufacturer, has introduced NeuralJet™, an artificial intelligence (AI)-powered inkjet technology that improves precision in semiconductor packaging ...

Advanced packaging has become a focal point for innovation as the semiconductor industry continues to push for increased transistor density and better performance. But the pace of change is ...

SEMICON Taiwan 2024 featured the latest trends and innovations that focused on the future of Artificial Intelligence (AI) to connect Taiwan and global semiconductor ecosystems. The high demand and ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...

Members can download this article in PDF format. It’s well-known that advanced packaging will separate the haves from the have nots in the race to effectively run artificial intelligence (AI), connect ...

Earnings Call Insights: Onto Innovation Inc. (NYSE:ONTO) Q4 2024 CEO Michael Plisinski highlighted a record quarterly revenue ...

Under the Department of Commerce, the program will provide funding for research and development projects to support U.S. semiconductor advanced packaging and strengthen the manufacturing and packaging ...