Companies Strengthen Collaboration with Successful Tape Out of HBM Customer Design, Certified EDA Flows, and PPA-Optimized IP on Samsung's Advanced Technologies "The adoption of Edge AI applications ...

CAMPBELL, Calif., April 30, 2025 (GLOBE NEWSWIRE) -- Arteris, Inc. (AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced that it has joined Intel ...

Cadence Design Systems, Inc. CDNS has announced an expansion of its long-standing collaboration with Taiwan Semiconductor Manufacturing Company (“TSMC”), aimed at accelerating time to silicon for ...

Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to accelerate design cycles and ...

In the manufacturing world, the word “retrofit” many times is feared to mean “lost production.” In other words, plants—or at least parts of plants—must be shut down for equipment to be upgraded. And ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence (Nasdaq: CDNS) today announced major advancements in chip design automation and IP, driven by its long-standing relationship with TSMC to develop advanced ...

The rising costs of AI chips driven by advanced process technologies have continued to escalate, while the direct performance gains from these process improvements have significantly diminished.

We had the opportunity to interview TSMC's Kevin Zhang, the deputy co-COO and SVP at TSMC, to discuss the latest trends in the semiconductor industry and how they impact TSMC's strategy moving forward ...

A former SK Hynix employee has been formally accused of illegally transferring technologies related to advanced chip packaging used for 3D NAND, HBM, and multi-chiplet assemblies as well as CMOS image ...