The major factors affecting the performance of crystalline thin films are the presence of grain boundaries and inherent crystal structure. Post-deposition annealing is frequently employed to improve ...

Researchers at École Polytechnique Fédérale de Lausanne (EPFL) and Center Suisse d’Electronique et de Microtechnique (CSEM) in Switzerland developed a novel single-step thermal annealing process for ...

A single-step high-pressure industrial process replaces complex irradiation methods, producing quantum-grade nanodiamonds ...

We use metals in construction, domestic appliances, vehicles, and many other everyday products. It really can be said that metals have built the modern world. To fine-tune the desired properties of ...

A technical paper titled “Solving the Annealing of Mo Interconnects for Next-Gen Integrated Circuits” was published by researchers at the National University of Singapore, A*STAR, and imec. “Recent ...

[Asia Economy Reporter Jang Hyowon] Yesty, a semiconductor equipment specialist company, announced on the 2nd that it has filed a patent related to high-pressure annealing technology applied to core ...

Manufacturers are turning to hybrid bonding to enable the ultra-dense 3D integration required for next-generation chip ...

Chinese researchers, led by a research team from PV Technology Center of Tongwei Co., Ltd, used a sequential annealing process in the fabrication of tandem solar cells, featuring a wide bandgap ...

Veeco Instruments Inc. announced the shipment of its NSA500™ Nanosecond Annealing system to a prominent semiconductor company for the production of 2-nanometer gate-all-around logic chips, marking a ...