EDN

BGA package prevents digital content piracy

Corpus Christi, Tex. — TT electronics IRC Advanced Film Division has developed a high-speed digital termination ball grid array (BGA) package that is designed to prevent signal theft in consumer ...
Business Wire

Samsung Mass Producing Industry’s First 512-Gigabyte NVMe SSD in a Single BGA Package for More Flexibility in Computing Device Design

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has begun mass producing the industry’s first NVMe* PCIe ...
EDN

Socket your BGA package using elastomer socket with superior electrical performance

Ironwood Electronics has recently introduced a new high performance elastomer socket for 0.4mm pitch BGA package. The SG25-BGA-2042 socket is designed for a 4.47mmx4.34mm package size and operates at ...
Nasdaq

SMART Modular Introduces PCIe NVMe Flash Storage Products in M.2 Type 1620 BGA Package and M.2 2230 Module

New BGAP520 PCIe NVMe product family addresses need for soldered-down and small module form factor Flash storage for industrial embedded market segments NEWARK, Calif., Dec. 08, 2020 (GLOBE NEWSWIRE) ...
HotHardware

Size Matters: AMD Strix Halo Leak Flexes LGA1700-Sized BGA Package For Mobile

Mobile processors these days don't come with sockets like desktop CPUs, but they're still manufactured for a specific package type. The package for AMD's "Phoenix" and "Hawk Point" processors is ...
Business Wire

Toshiba to Showcase World's First PCI Express Single Package SSD at CES

TOKYO--(BUSINESS WIRE)--Toshiba Corporation’s (TOKYO:6502) Semiconductor & Storage Products Company announced it will showcase a reference display of the world’s first [1] PCI Express (PCIe) single ...
Electronic Design

BGA Package Design Prevents Signal Theft In Consumer Electronics

TT Electronics subsidiary IRC Inc. now offers a high-speed digital-termination ball-grid-array (BGA) package designed to prevent signal theft in consumer electronics devices. The CHC series’ BGAs are ...
eTeknix

Intel’s Haswell To Ship In Three BGA Packages

There has been much speculation in the industry about whether Intel will stop making LGA package processors in favour of BGA package processors. Well, this speculation may have some traction in the ...
Electronic Design

Different BGA Packages Accommodated By BGA Socket

The Configurable High Insertion Count (CHIC) Socket lets users of programming and automatic test equipment accommodate any BGA package. It improves electrical contact reliability compared to ...
Mena FN

Ball Grid Array (BGA) Package Market To Reach US$ 7.15 Billion By 2032 With A 5.03% CAGR

The Ball Grid Array (BGA) Package Market is poised for steady growth as the demand for compact, high-performance Semiconductor packaging continues to rise. Valued at $4.6 billion in 2023, the market ...
Hackaday

Working With BGAs: Design And Layout

The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...