SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has begun mass producing the industry’s first NVMe* PCIe ...

Corpus Christi, Tex. — TT electronics IRC Advanced Film Division has developed a high-speed digital termination ball grid array (BGA) package that is designed to prevent signal theft in consumer ...

TOKYO--(BUSINESS WIRE)--Toshiba Corporation’s (TOKYO:6502) Semiconductor & Storage Products Company announced it will showcase a reference display of the world’s first [1] PCI Express (PCIe) single ...

New BGAP520 PCIe NVMe product family addresses need for soldered-down and small module form factor Flash storage for industrial embedded market segments NEWARK, Calif., Dec. 08, 2020 (GLOBE NEWSWIRE) ...

Ironwood Electronics has recently introduced a new high performance elastomer socket for 0.4mm pitch BGA package. The SG25-BGA-2042 socket is designed for a 4.47mmx4.34mm package size and operates at ...

The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...

TT Electronics subsidiary IRC Inc. now offers a high-speed digital-termination ball-grid-array (BGA) package designed to prevent signal theft in consumer electronics devices. The CHC series’ BGAs are ...

Mobile processors these days don't come with sockets like desktop CPUs, but they're still manufactured for a specific package type. The package for AMD's "Phoenix" and "Hawk Point" processors is ...

The Configurable High Insertion Count (CHIC) Socket lets users of programming and automatic test equipment accommodate any BGA package. It improves electrical contact reliability compared to ...

Package-on-package (PoP) assembly is a quickly evolving 3D packaging trend (or, to be more politically correct, "technique") that meets today's demand for lighter, faster and miniaturized electronics, ...

The Ball Grid Array (BGA) Package Market is poised for steady growth as the demand for compact, high-performance Semiconductor packaging continues to rise. Valued at $4.6 billion in 2023, the market ...