Traditional lithography remains a standard in the industry, providing precision and a relatively cost-effective way to create patterns on the wafer when producing very high volumes of chips. However, ...

Several companies are developing or shipping next-generation e-beam inspection systems in an effort to reduce defects in advanced logic and memory chips. Vendors are taking two approaches with these ...

MILPITAS, Calif., July 20, 2020 /PRNewswire/ -- Today KLA Corporation (NASDAQ: KLAC) announced the revolutionary eSL10™ e-beam patterned-wafer defect inspection system. The new system is designed to ...

A high-power (120kV, 60kW) electron-beam welding system has been developed for the first time in the country, paving the way to the domestic production of a local vacuum** high-power electron-beam ...