Flip-chip bonding is the process of bonding on-chip electrodes to printed circuit board (PCB) electrodes using Au bumps. The bond strength influences the circuit’s conductivity directly, without the ...

A review of the use of adhesives for device assembly, focusing on optical radiation curing using UV light. by B. G. Yacobi, Chris Le Conte, Kevin Davis, and Manfred Hubert New equipment, such as the ...

The industry’s unquenchable thirst for I/O density and faster connections between chips, particularly logic and cache memory, is transforming system designs to include 3D architectures, and hybrid ...

NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, is ...

Injection-molded liquid silicone rubber (LSR) is used in the manufacture of many goods, from medical devices to cookware to electronics. Many LSR applications require that the silicone be bonded to ...

A new type of 3D-printed adhesive could change how we join materials together. So far, scientists have developed two new methods that can create extremely strong bonds at the pore level, eliminating ...

The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory ...