SINGAPORE, Nov. 13, 2024 /PRNewswire/ -- Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa", "K&S", "we" or the "Company"), in collaboration with ROHM Co., Ltd (TYO: 6963) ("ROHM"), ...

The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory stack. A JEDEC move made that unnecessary with this generation, but it’s ...

Flip-chip bonding is the process of bonding on-chip electrodes to printed circuit board (PCB) electrodes using Au bumps. The bond strength influences the circuit’s conductivity directly, without the ...

Injection-molded liquid silicone rubber (LSR) is used in the manufacture of many goods, from medical devices to cookware to electronics. Many LSR applications require that the silicone be bonded to ...

NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, is ...

“In response to market needs for more sophisticated integration processes for combining materials with different coefficients of thermal expansion, we have developed a revolutionary process technology ...

ST. PAUL, Minn., Sept. 16, 2021 /PRNewswire/ -- 3M(NYSE:MMM) Industrial Adhesives and Tapes Division is evolving its Bonding Process Centers in St. Paul, USA; Neuss, Germany; and Shanghai, China.

Bonding the display cover glass and touchscreen directly to the front of an LCD, the G-Bond optical enhancement process increases contrast and improves the display quality of an LCD by reducing ...