Kinex™ is the industry’s first integrated die-to-wafer hybrid bonding system; enables production of higher performance, lower power advanced logic and memory chips Xtera™ system enables higher ...

Article 250 of the National Electrical Code (NEC) focuses on grounding and bonding. This Code Article is divided into 10 separate parts — each identified by a Roman numeral. Because of the terminology ...

In addition to plastic technologies for reducing weight of car bodies, Dow Automotive has developed a new bonding system for the structural bonding of aluminium roofs with steel car bodies which was ...

“Following a thorough evaluation of a number of wafer bonding systems, we selected EVG's solution for its superior technology capabilities. The affordable R&D system demonstrated outstanding results, ...

*Many factors can affect the device thickness. Process optimizations might be necessary. Laser debonding results at 308 nm using BrewerBOND T1107 (2 µm) and BrewerBOND C1301-50 (60 µm) materials, with ...

BREA, Calif., April 25, 2025 /PRNewswire/ -- Ormco™ Corporation, a global leader in orthodontic solutions for over 60 years, is thrilled to announce the modernization of the commonplace adhesive and ...

I often see transformer installations where the installer uses a white wire as the system bonding jumper. Is this permitted? Or is it a violation? Well, let’s look at some of the applicable rules.