SAN JOSE, Calif. — Novellus Systems Inc. moved to lower the cost of chemical mechanical planarization (CMP) Monday (June 21) by rolling out a 300-mm tool that it claimed could be used down to the ...
Novellus Systems Inc. says it has taken what was good about SpeedFam-IPEC's technology and fixed what wasn't with Xceda. The Silicon Valley-based back-end-of-line process tool vendor today unveiled ...
ACM Research Introduces New Post-CMP Cleaning Tool for Silicon and SiC Wafer Substrate Manufacturing
FREMONT, Calif., July 12, 2022 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...
It's critical that the surface of silicon wafers be as flat as possible so that as each metal layer is patterned, you minimize the risk of moving in and out of the focal plane of the imaging system.
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