Open-source tools and multi-project wafer (MPW) shuttles democratize chip design for low cost. Small circuits, both analog and digital, are accommodated by embedding them as “tiles” or “clusters” into ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence (Nasdaq: CDNS) today announced major advancements in chip design automation and IP, driven by its long-standing relationship with TSMC to develop advanced ...

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology The Cadence Integrity ™ 3D-IC Platform now features enhanced support for improved ...

In the fast-paced realm of semiconductor technology, optimizing chip design to meet the dual challenges of performance enhancement and cost reduction has emerged as a pivotal focus. A new study ...

Like any successful system-on-chip (SoC) effort, a multi-die system-in-package (SiP) project must start with a sound system design. But then what? Are the steps in the SiP design flow different from ...

This is a sponsored article brought to you by Siemens. In the world of electronics, integrated circuits (IC) chips are the unseen powerhouse behind progress. Every leap—whether it’s smarter phones, ...

A programming framework could streamline chip design by bridging the gap between conceptual design and practical execution [1]. This may help address the ongoing challenge in the computer hardware ...

The EDA market segment and its product portfolio have a huge impact on the semiconductor industry. Without automation tools for chip/system design and verification, there would be no new advanced ...

The US has rescinded export curbs on critical chip design tools as part of broader agreement on access to rare earth minerals. The US has lifted export restrictions on semiconductor design software to ...