For decades, electronics hobbyists would make a quick jaunt to a Radio Shack or Fry’s Electronics to find parts for their DIY projects. With those brick-and-mortar chains gone, one would think that ...

As smart electronic devices become smaller and more powerful, they can generate a lot of heat, leading to slower processing times and sudden shutdowns. Now researchers use an electrospinning approach ...

As smart electronic devices become smaller and more powerful, they can generate a lot of heat, leading to slower processing times and sudden shutdowns. Now, in ACS Applied Nano Materials, researchers ...

The following essay is reprinted with permission from The Conversation, an online publication covering the latest research. Not only people need to stay cool, especially in a summer of record-breaking ...

The U.S. Air Force recently awarded a three-year/$750,000 research grant to the University of Virginia’s (UVA) ExSiTE Lab (Experiments and Simulations in Thermal Engineering) to evaluate the prospect ...

(Nanowerk Spotlight) As electronics become smaller, faster and more powerful, managing the heat they generate is becoming increasingly challenging. Densely packed 3D electronics, made by stacking ...

Transparent transistors and circuits that could be used in a wide-range of applications from e-paper and flexible color screens for electronics gear to smart cards and “heads-up” displays in auto ...

At the CES consumer-electronics show in Las Vegas this week, the company will show off technologies including highway and urban autonomous driving, as well as the ability to follow the vehicle in ...

In a vacuum: Empa doctoral student Johanna Byloff prepares the samples on the coating machine of the Empa spin-off Swiss Cluster. The picture that pops up before our inner eye when we hear the word ...

A team of scientists led by University of Virginia professor Patrick Hopkins is developing a plasma "freeze ray" that will be less interesting to super villains than to engineers looking for ways to ...

Thermal management has long been a key challenge facing design engineers. For decades, engineers have faced trying to dissipate heat from densely packed electronics that have continued to shrink in ...