In a recent campaign of Experimental Advanced Superconducting Tokamak (EAST), researchers from the Hefei Institutes of Physical Science (HFIPS) of the Chinese Academy of Sciences (CAS) and their ...

Copper (Cu) redistribution layer (RDL) technology is used to interconnect chips in various high current Wafer Level Packaging (WLP) applications. Typically, Cu RDLs with thicknesses of 5-9 µm and ...

After years of searching, scientists at the Micro Booster Neutrino Experiment (MicroBooNE) have ruled out the possibility of the existence of a sterile neutrino, a hypothetical particle that had long ...