High-power semiconductor applications currently represent one of the highest growth sectors of any semiconductor technology, specifically because many of the key applications are driven by the ...

Global Die-Attach Materials Market to Reach $834 Million by 2026 Die-attach also known as die bonding relates to the method of affixing a semiconductor die to a substrate (such as a PCB board), or to ...

Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...