QPT just filed a patent for the “qAttach” process, a novel way to attach dies to heat spreaders or substrates (typically aluminum nitride (AlN)) that significantly reduces thermal resistance. The new ...

Editor?s note: Chris Rauwendaal is a designer, consultant, and seminar instructor who has written extensively on process engineering and extrusion topics. Part 1 of this article (PM&A Nov./Dec. 2002) ...

The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...

Multi-die assemblies are becoming more common and more complex due to technology advancements and market demands, but differing die dimensions are making this process increasingly challenging. To ...

The power electronics industry is facing a problem in that, as the power handled by transistors increases to meet the needs of new applications, the packaging will increasingly struggle to remove the ...

The press brake department has been called the heart of precision sheet metal fabrication. What happens there affects what ...