QPT just filed a patent for the “qAttach” process, a novel way to attach dies to heat spreaders or substrates (typically aluminum nitride (AlN)) that significantly reduces thermal resistance. The new ...

The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...

Multi-die assemblies are becoming more common and more complex due to technology advancements and market demands, but differing die dimensions are making this process increasingly challenging. To ...

DFM techniques can go only so far in ironing out intra-die process variability. That's because DFM techniques to date haven't fully addressed parametric yield issues. Stratosphere Solutions, a ...

The power electronics industry is facing a problem in that, as the power handled by transistors increases to meet the needs of new applications, the packaging will increasingly struggle to remove the ...

Since 1975, TPSi, headquartered in Tulsa, OK, has continuously grown and evolved their business model and corresponding production equipment to adapt to an ever-evolving industry. Seeking to ...