BearingPoint assisted Aktia in implementing Workiva, a cloud-based document and data collaboration tool, to streamline financial and ESG reporting and improve collaboration. AMSTERDAM--(BUSINESS WIRE) ...

LONDON & NEW YORK--(BUSINESS WIRE)--Sirion, the category leader in AI-native contract lifecycle management (CLM), is excited to announce the acquisition of Eigen Technologies, the market leader in ...

Successful collaboration in legal document management requires a unified effort from multiple stakeholders, ranging from lawyers and paralegals to subject matter experts and business leaders. By ...

OneTrust uses AI to analyze the entire context, patterns, and terms within an unstructured file to not only identify the terms and classifications in the file, but also the type of file. ATLANTA, May ...

New models of products are introduced regularly and often require a new way of interacting with a product. Imagine if that change—requiring that electric vehicle consumers replace fluids more ...

A new collection of over 1,200 documents detailing the Central Intelligence Agency’s (CIA) infamous mind control program, MKULTRA, was published by the National Security Archive and ProQuest on Monday ...

While document management systems and content management systems have some overlap there are key differences that you should know about. The IDC projected in a 2020 report that enterprise data will ...

Despite the ongoing digital transformation, many organizations today still spend quite a bit of time manually processing information from countless documents. Because of the nature of digital files ...

ABERDEEN PROVING GROUND, Md. — The U.S. Army will continue experimentation and prototyping via an Other Transaction Authority (OTA) agreement to Team Anduril on behalf of Program Executive Office ...

OpenAI is introducing a new data residency program in Asia, the company announced Thursday, following the rollout of its data residency program in Europe in February. The new program, which is ...

Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...