With shrinking chip sizes, Wafer Level Packaging (WLP) is becoming an attractive packaging technology with many advantages in comparison to standard Ball Grid Array (BGA) packages. With the ...

With shrinking of chip sizes, Wafer Level Chip Scale Packaging (WLCSP) becomes an attractive and holistic packaging solutions with various advantages in comparison to conventional packages, such as ...

STMicroelectronics, STATS ChipPAC, and Infineon Technologies have agreed to jointly develop the next generation of embedded wafer-level ball-grid array (eWLB) technology. The R&D effort will focus on ...

Semiconductor makers STMicroelectronics and Infineon have teamed with 3D packaging provider STATS ChipPAC to jointly develop the next generation of embedded Wafer-Level Ball Grid Array (eWLB) ...

SAN JOSE, Calif. – STATS ChipPAC Ltd. recently celebrated the grand opening of its new 300-mm embedded wafer-level ball grid array (eWLB) manufacturing facility. The official inauguration was recently ...

STATS ChipPAC has expanded the embedded wafer-level ball-grid array (eWLB) technology to reconstituted 300mm wafers, according to the company. By adding capacity through 300mm wafer manufacturing, ...

SAN JOSE, Calif. — Singapore's STATS ChipPAC Ltd. has expanded its embedded wafer-level ball grid array (eWLB) technology to reconstituted 300-mm wafers. STATS ChipPAC has invested more than $100 ...

STATS ChipPAC has shipped over one billion fan-out wafer level packages (FOWLP), also known in the industry as embedded wafer-level ball grid array (eWLB), according to the company. Save my User ID ...