Taking place at the end of the semiconductor process flow, dicing is the process where the silicon wafer is finally turned into individual chips, or die, traditionally by means of a saw or laser. A ...

This means that if you really know the basics well, you will excel at the rest. One thing you can be sure of is the human tendency to forget. ... 7 comments on “ Three things they should have taught ...

What he won’t be anticipating will be a crash course in Political Engineering 101. What you’ll be doing your best to anticipate is what will George find persuasive, ...

When I taught Engineering Ethics in graduate school, I was advised to focus on case studies: the Ford Pinto; the Challenger; trampling disasters at large venues with horrible exit designs.

Widely used as a genome editing tool, the CRISPR-Cas9 system allows researchers to precisely induce frameshift mutations in specific genes or insert foreign nucleic acid sequences into a cell’s DNA.