前面的文章我们对DFT做了一个整体介绍，本文我们对DFT的基本概念--缺陷和故障模型做一个全面的介绍，所有的DFT工作都是为了检测这些缺陷的。 缺陷是指电路因物质方面的原因而改变了其本来的结构，它出现在器件制造或使用阶段，通常是指因制造加工条件的 ...

Overview: We have developed an accurate fault modeling tool to capture variation-induced faults in Networks-on-Chip (NoCs). The core of our fault model has circuit-level accuracy, while its ...

The IDDQ test relies on measuring the supply current (I DD) of an IC’s quiescent state, when the circuit isn’t switching and inputs are held at static values. Test patterns are used to place the ...

The electronics industry is in the midst of a transformation that is drastically changing product design and manufacture. Deep submicron process technology puts more gates on a chip, and the ...

The current shift in the test methodologies is away from the ubiquitous single stuck-at fault model. The best test for any device is to exhaustively test the device. The quality of such a test would ...

One of the key factors in preparing for the “Big One,” the next massive earthquake in California, is estimating “slip rate,” the speed at which one side of the San Andreas Fault is moving past the ...

ATPG targets faults at IC-gate boundaries, but 50% of defects are located within cells. Learn how cell-aware ATPG and user-defined fault models help to ferret out these hard-to-squash bugs.