Flip chip packaging represents a cutting‐edge assembly technique in which semiconductor devices are mounted upside‐down, enabling direct connection to the substrate via solder bumps. This method not ...

It seems that Samsung Foundry has finally managed to stabilize its 3nm GAA chip production process. The company was struggling with it for a long time, even preventing the implementation of the Exynos ...

Samsung is reportedly collaborating with Qualcomm to develop a customized version of the Snapdragon 8 Elite Gen 5 chip, using Samsung’s advanced 2-nanometer SF2 process. This partnership aims to ...

TORONTO, Dec. 17, 2020 (GLOBE NEWSWIRE) -- POET Technologies Inc. (“POET” or the “Company”) (TSX Venture: PTK; OTCQX: POETF) the designer and developer of the POET Optical Interposer™ and Photonic ...