Flip chip packaging represents a cutting‐edge assembly technique in which semiconductor devices are mounted upside‐down, enabling direct connection to the substrate via solder bumps. This method not ...

It seems that Samsung Foundry has finally managed to stabilize its 3nm GAA chip production process. The company was struggling with it for a long time, even preventing the implementation of the Exynos ...

Samsung is reportedly collaborating with Qualcomm to develop a customized version of the Snapdragon 8 Elite Gen 5 chip, using Samsung’s advanced 2-nanometer SF2 process. This partnership aims to ...

Samsung Foundry had been riding a wave of optimism after finally stabilizing its 3nm process, fueling hopes that the Exynos 2500 could compete with Qualcomm’s best. Early Z Flip 7 prototypes were ...

A new report strongly suggests that the Exynos 2500 will debut in the Galaxy Z Flip 7. Most regions will apparently get the Exynos chip, while the US, China, and Canada will stick with Snapdragon.