“3D heterogeneous integration (3D HI) offers promising solutions for incorporating substantial embedded memory into cutting-edge analog compute-in-memory (CIM) AI accelerators, addressing the need for ...

Leuven, Belgium – Ocotober 1, 2009 – IMEC and its 3D integration partners have taped-out Etna, a new 3D chip integrating a commercial DRAM chip on top of a logic IC. The new 3D stack resembles as ...

Custom Materials, Inc., a leading innovator in advanced material solutions, is shaping the future of 3D Integrated Circuits (3D IC). The leading custom fabrications company is elevating its ...