Optimization of Power Delivery Network Design for 3D Heterogeneous Integration of RRAM-based Compute In-Memory Accelerators” was published by researchers at Georgia Tech. Abstract: “3D heterogeneous ...

Research in 3D integration has ... CMOS scaling beyond 32nm: Challenges and opportunities, Design Automation Conference, 2009. DAC '09. 46th ACM/IEEE, 2009, pp. 310-313. [12] G. M. Link and N.

2009 – IMEC and its 3D integration partners have taped-out Etna, a new 3D chip integrating a commercial DRAM chip on top of a logic IC. The new 3D stack resembles as close as possible to future ...

Graphisoft is designing a digitized future for the AEC industry with mindful integration of Generative AI and bringing key tools to the cloud to enable more collaborative workflows.