New technology from University of Houston researchers could improve the way devices manage heat, thanks to a technique that allows heat to flow in only one direction. The innovation is known as ...

The boundary element method (BEM) has emerged as a powerful numerical tool for addressing heat conduction problems by reducing the computational domain to its boundary. This methodological advantage ...

MIT researchers have designed silicon structures that can perform calculations in an electronic device using excess heat ...

University of Houston researchers have developed a new way to make heat flow in ...

UCLA researchers identify a metal with ~3× the heat conduction of copper, offering a potential leap in cooling for chips, AI accelerators, and next-gen electronic systems.

Modern winter jackets are also a testament to centuries-old physics and cutting-edge materials science.

NIMS, in joint research with the University of Tokyo, AIST, the University of Osaka, and Tohoku University, have proposed a novel method for actively controlling heat flow in solids by utilizing the ...