The boundary element method (BEM) has emerged as a powerful numerical tool for addressing heat conduction problems by reducing the computational domain to its boundary. This methodological advantage ...

Scientists in the US have created a tiny silicon chip that can perform mathematical ...

MIT researchers have designed silicon structures that can perform calculations in an electronic device using excess heat ...

UCLA researchers identify a metal with ~3× the heat conduction of copper, offering a potential leap in cooling for chips, AI accelerators, and next-gen electronic systems.

University of Houston researchers have developed a new way to make heat flow in ...

Modern winter jackets are also a testament to centuries-old physics and cutting-edge materials science.