How does one achieve electrically aware custom IC design? For one thing, through real-time, in-design parasitic extraction and analysis. Cadence's David White and Michael McSherry explain. Fig 1.

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

China has had a long history of supporting its semiconductor development with industrial policies. The "Outline for advancing the national IC industry" announced in 2014 upgraded semiconductors from a ...

US-based semiconductor solutions provider Qorvo has partnered with electronic design automation software and engineering services supplier Cadence Design Systems to help Vietnam boost the talent ...

One cannot imagine the world now and in the future without integrated circuits (IC or generally known as chips). With worldwide revenue projected to be about $500 billion by the end of 2019, the chip ...

Advanced packaging techniques are viewed as either a replacement for Moore’s Law scaling, or a way of augmenting it. But there is a big gap between the extensive work done to prove these devices can ...

In the analog/mixed-signal (AMS) arena, automated design of advanced ICs has long remained an objective rather than a reality. For the AMS design expert, automated tools have too often seemed to ...

3D ICs are an exciting and promising extension of heterogeneous advanced package technology into the third dimension. Although far from mainstream, 3D IC’s time is coming, as chiplet standardization ...

The AI-powered Copilot hardware design tool provides a chatbot-like assistant with a wealth of knowledge at your fingertips. What is Copilot and how does it use AI? The capabilities of Copilot.