Experts at the Table: Semiconductor Engineering sat down to discuss the changes in design tools and methodologies needed for 3D-ICs, with Sooyong Kim, director and product specialist for 3D-IC at ...

Why it's essential to combine sign-off accuracy, iterative feedback, and intelligent automation in complex designs.

This file type includes high-resolution graphics and schematics when applicable. Michael White, Director of Product Marketing, Calibre Physical Verification products, Mentor Graphics In recent years, ...

Layout for ICs at process geometries of 90 nm and below becomes a very dicey affair. Even at 180 nm, the number of design rules that must be enforced for an ASIC or system-on-a-chip to be ...

Design of power/driver ICs in compliance with latchup qualification requirements involves a conceptually different approach in comparison with digital LV (low voltage) ICs. The LV ICs’ electrostatic ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

The strengths of Taiwan's IC design sector include excellent and dedicated STEM talent, a complete semiconductor industry ecosystem from upstream to downstream, and a well-developed downstream ICT ...

The US Department of Commerce unveiled modified rules to impose further export curbs on advanced chips and semiconductor manufacturing equipment to China, with chipmakers such as Nvidia, Intel, and ...