A new technical paper titled “Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects” was published by researchers at Siemens EDA, D2S, and Univ.

I’m not talking about carnival funhouse mirrors, but rather the different options for mirroring symbols, vias, and bond fingers in your IC Package layout. The Allegro Package Designer Plus and SiP ...

Targeting a silicon device for a flip-chip package introduces significant IC and package design complexities throughout the entire product development cycle. This package-die combination must be ...

What are the 2 categories of mounting method in IC packaging? Describe these categories and its package types. The final step in IC fabrication is packaging the device in a suitable medium that can ...

STMicroelectronics has introduced two miniature IC package types which are less than one millimetre thick. The MSOP8 package, also called TSSOP8 3×3 according to JEDEC standards, is claimed to be 23 ...