Amkor Technology Inc. today unveiled a high-density manufacturing process that it claims changes the way leadframe-based ICs are packaged and assembled. The Chandler, Ariz.-based company’s (nasdaq: ...

3D-ICs are proving a challenge even for designers accustomed to dealing with power and performance tradeoffs, but they are considered an inevitable migration path for leading-edge designs due to the ...

Leidos has released a new study on mental health stigma within the Intelligence Community (IC) and implications for the security clearance investigation process. The research shows that despite ...

IC design houses are hesitant to place orders for mature process manufacturing with foundries, due to the still uncertain market outlook for the second half of this year, according to industry sources ...

San Jose, Calif. — Intensive CAD research at universities and semiconductor manufacturers is yielding new solutions for grappling with IC process variability. Presentations at last week's ...

A packaging process developed by Amkor Technology of Chandler, Ariz., is being described by the company as the packaging equivalent of a semiconductor move from 200- to 300-mm wafers. The company's ...

In an era where artificial intelligence, autonomous vehicles, and high-performance computing push the boundaries of semiconductor technology, the thermal management of 2.5D and 3D integrated circuits ...

The manufacture of automotive ICs will continue to rely mainly on mature process technologies, according to Denise Lee, senior consultant at McKinsey. Speaking at a forum during the ongoing SEMICON ...

SAN FRANCISCO--(BUSINESS WIRE)--Project Frog, a leader in developing scalable Industrialized Construction (IC) solutions with an integrated building system product and technology approach, today ...

Verification Suite Streamlines IC Design Process Designed specifically for IC designers using hardware-assisted verification platforms, the Emulation Edge verification suite speeds the functional ...