Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

The process control and instrumentation minor emphasizes developing skills and knowledge in theory, software and in the field. Students graduate ready to solve complex control problems in the chemical ...

As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...

Some wonder if AI will replace PID control loops. The reality is that, instead of replacing PID, AI is stepping in to help keep things running smoothly without upending regulatory trust. Think of AI ...

Marcus Hoversland, a UW graduate and process engineer at HF Sinclair in Casper, interacts with UW students in an “Intro to Chemical Engineering” class. UW has received a generous investment from HF ...

A new chip manufacturing process from Intel Corp. failed to meet Broadcom Inc.’s expectations in a recent evaluation, Reuters reported today. The development may mark a setback for Intel’s foundry ...