电子工程专辑

带你认识创新性LGA封装

LGA：Land Grid Array，栅格阵列封装。 这项技术最早应用于英特尔处理器上，因为这种封装技术相比之前的“金属触点式封装”有很多优点，所以，很快就普及了。 随着市场需求的不断变化，在单芯片上使用LGA封装技术已经不能满足需求了，于是，出现了将多种 ...
Design-Reuse

Actel Introduces Land Grid Array Packaging Option for Radiation-Tolerant RTAX-S FPGA Family

Low-Profile Package Provides Enhanced Performance and Flexibility for Mission-Critical Military and Aerospace Designs MOUNTAIN VIEW, Calif., July 7 /PRNewswire ...
EDN

Stats expands wireless options with Land Grid Array

SINGAPORE — ST Assembly Test Services Ltd. has expanded its portfolio of solutions for wireless applications with the addition of Land Grid Array (LGA). The LGA is a laminate substrate-based, fine ...
The Engineer

Land Grid Array Capacitors Achieve High-Frequency Performance

Land Grid Array capacitors from AVX have achieved, thanks to patented design innovations, the equivalent high-frequency performance of complex 8-terminal Inter- Digitated Capacitors in a simple ...
Semiconductor Engineering

WLFO For High-Performance Low-Cost Packaging Of RFMEMS-CMOS

Navigating the trade-offs between performance, size, cost and reliability can be a challenge when considering integrated circuit (IC) packaging and the end-application. The integration of ...
EDN

Why LGA beats BGA for Digital Power Modules

Although LGA (land grid array) and BGA (ball grid array) packaging seem quite similar – LGA packaging is basically BGA packaging without the solder balls – there are some significant differences that ...
Semiconductor Engineering

Wafer-Level Fan-Out For High-Performance, Low-Cost Packaging Of Monolithic RF MEMS/CMOS

Navigating the trade-offs between performance, size, cost and reliability can be a challenge when considering integrated circuit (IC) packaging and the end-application. The integration of ...