今日释放5份75折优惠券,领即领即用,过期失效。 本课程主要分享静电保护的市场需求,技术挑战及如何设计高抗性的芯片级ESD/Latch-up 防护。前半段以深入浅出的方式讲解ESD防护设计概念,后半段解密如何使用代工厂提供的免费ESD器件保护您的芯片,并且延伸 ...
本课程主要分享静电保护的市场需求,技术挑战及如何设计高抗性的芯片级ESD/Latch-up 防护。前半段以深入浅出的方式讲解ESD防护设计概念,后半段解密如何使用代工厂提供的免费ESD器件保护您的芯片,并且延伸至全芯片ESD/Latch-up 防护。 此课程兼顾理论及配合 ...
All semiconductor devices are sensitive to electrostatic discharge (ESD) damage to varying degrees. This is true whether they are soldered to a PC board in an application, or whether they are ...
2.5D/3D ICs have evolved into an innovative solution for many design and integration situations, but they present unique verification obstacles that challenge electronic design automation (EDA) tools ...
2.5D/3D integrated circuits (ICs) have evolved into an innovative solution for many IC design and integration challenges. As shown in figure 1, 2.5D ICs have multiple dies placed side-by-side on a ...
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