TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a highly reliable manufacturing technology that configures a high definition silver plated area for lead frames ...

Dai Nippon Printing Co (DNP) has developed a new lead frame in response to efforts to slim down the semiconductor package mounted on electronic devices, including mobile terminals and PCs. Using this ...

This family of lead-frame packages has been extended to include dual-sided units. Said to combine the performance of array packages with the lower cost of lead frames, the dual, fine-pitch, no-lead ...

Taiwan-based IC lead frame maker Chang Wah Technology (CWTC) expects to gain momentum for its automotive product segment in 2024, driven by major achievements in car chip developments... Taiwan-based ...

Advanced Interconnect Technologies Inc. (AIT) has announced two new versions of its lead-frame package family that the company claims combine the best attributes not only of lead-frame but of array ...

PLEASANTON, Calif. — Advanced Interconnect Technologies Inc. (AIT) said today (April 28, 2003) it has developed a style of package it calls flip-chiip on standard leaded (FCOSL) packages. These ...

Australian technology firm Lednium has developed a domed lead-frame package to improve light distribution in LED lighting. “It is a natural progression when creating a source of Illumination from what ...

DNP has taken advantage of our microfabrication technology developed over many years to successfully achieve the configuration of lead frame silver plated area of ±25um. It has also been possible to ...

- Verified the highest MSL 1 (=30°C/85% RH unlimited) ranking - Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a highly reliable manufacturing technology that configures a high ...