SEMI spoke with Udo Gómez, senior vice president at Robert Bosch GmbH, about MEMS technology requirements relative to standard IC design and manufacturing. Gómez highlighted solutions to challenges of ...

Start-up semiconductor packaging supplier Ziptronix Inc. has developed a MEMS encapsulation process it said can reduce the high packaging costs that have delayed the acceptance of MEMS technology. The ...

DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/xfdcdv/mems_frontend) has announced the addition of the "MEMS Front-End ...

PARIS — Memscap SA, French provider of micro-electromechanical systems (MEMS), announced it has extended its MUMPs (Multi-User MEMS Processes) manufacturing and prototyping services with the ...

Academic and industrial research scientists and engineers, as well as students working in micro-electromechanical systems (MEMS), commonly encounter a steep learning curve when developing common MEMS ...

--Integrated design-to-production services speed development of piezoelectric sensor or actuator chips for performance-driven products AMAGASAKI, Japan & BURLINGAME, Calif.--(BUSINESS WIRE)--A.M.

If you're looking for a challenge, try interconnecting microelectromechanical-systems (MEMS) ICs with conventional ICs and other MEMS ICs. If you've mastered that skill, move to the front of the line, ...

Recently TDK released the InvenSense TCE-11101, a miniaturized ultra-low power MEMS gas sensor platform for direct and accurate detection of CO2. The device ...