An energy-efficient way to improve the performance of electronics systems would be to integrate microfluidic cooling channels into chips, to prevent overheating. However, state-of-the-art ...

A new technique for fabricating liquid cooling channels onto the backs of high-performance integrated circuits could allow denser packaging of chips while providing better temperature ...

Matioli’s team had managed to engineer a 3D network of microfluidic cooling channels within the chip itself, right under the active part of each transistor device, just a few micrometers away from ...

However, manual optimization of such a cooling design is challenging due to the nonlinearity of the problem. In this paper, we explore the usage of topology optimization as a method to tailor ...

Microsoft is adopting direct-to-chip liquid cooling and exploring the potential of microfluidics. In a recent blog detailing the company’s water use and cooling ambitions, Microsoft outlines some of ...

Reliable high-density, high-performance, and for some applications, high-power microelectronics with an incredibly powerful, integrated cooling capacity.

Researchers have designed a self-cooling microchip that could not only advance computing, but do so more sustainably.

Liquid cooling moves onto the chip for denser electronics Date: October 5, 2015 Source: Georgia Institute of Technology Summary: Using microfluidic passages cut directly into the backsides of ...

Researchers have created a single chip that combines a transistor and micro-fluidic cooling system. Their research should help save energy and further shrink the size of electronic components.

Using microfluidic passages cut directly into the backsides of production field-programmable gate array devices, Georgia Institute of Technology researchers are putting liquid cooling right where ...

EPFL researchers have created a single chip that combines a transistor and micro-fluidic cooling system. Their research, which has been published in Nature, should help save energy and further ...