- 1500+最新前瞻技术解析在知识星球发布，欢迎学习交流 导语：近期，我们对 2025年功率芯片内嵌式PCB封装的最新技术进展做了系统梳理，覆盖Infineon-Schweizer S-Cell/Smart p²Pack、Fraunhofer IZM、Würth Elektronik 关于芯片嵌埋式PCB封装技术（Chip Embedded PCB Packaging）我们曾 ...

导语：9月24日-26日，有幸参加了上海浦东举办的PCIM Asia Shanghai 国际研讨会，作为全球电力电子领域最具影响力的产业研讨盛会之一，本届大会以"创新驱动未来能源变革"为核心主题，汇聚了英飞凌、日立能源、Fuji、中国科学院、浙江大学、华为数字能源等全球 ...

The first article in this series titled “The common silicon issues in analog IP integration” focused on system-on-chip (SoC) design issues related to incorporating analog IP. Here we begin expanding ...

A significant divergence emerged as Taiwan and China concluded their major PCB industry exhibitions in late October 2025. While Taiwanese manufacturers focused on supply bottlenecks for copper-clad ...

Co. plans to invest up to US$300 million in a high-density optical-electrical printed circuit board (PCB) project aimed at ...

The previous articles in this series showed how the successful integration of IP—especially analog/RF, but digital as well—is essentially pre-determined by the practices of the chip development team ...

Groomed for high density PCB packaging, the company’s latest surface-mount retainer accepts all ML414 micro lithium batteries from all major manufacturers and is compatible with all soldering and ...