- 1500+最新前瞻技术解析在知识星球发布，欢迎学习交流 导语：近期，我们对 2025年功率芯片内嵌式PCB封装的最新技术进展做了系统梳理，覆盖Infineon-Schweizer S-Cell/Smart p²Pack、Fraunhofer IZM、Würth Elektronik 关于芯片嵌埋式PCB封装技术（Chip Embedded PCB Packaging）我们曾 ...

导语：9月24日-26日，有幸参加了上海浦东举办的PCIM Asia Shanghai 国际研讨会，作为全球电力电子领域最具影响力的产业研讨盛会之一，本届大会以"创新驱动未来能源变革"为核心主题，汇聚了英飞凌、日立能源、Fuji、中国科学院、浙江大学、华为数字能源等全球 ...

The first article in this series titled “The common silicon issues in analog IP integration” focused on system-on-chip (SoC) design issues related to incorporating analog IP. Here we begin expanding ...

A significant divergence emerged as Taiwan and China concluded their major PCB industry exhibitions in late October 2025. While Taiwanese manufacturers focused on supply bottlenecks for copper-clad ...

PCB and semiconductor equipment manufacturer Ta Liang Technology reported a surge in orders as AI chip and AI server demand solidifies. Customers have been investing to expand capacity, driving demand ...

The previous articles in this series showed how the successful integration of IP—especially analog/RF, but digital as well—is essentially pre-determined by the practices of the chip development team ...

Groomed for high density PCB packaging, the company’s latest surface-mount retainer accepts all ML414 micro lithium batteries from all major manufacturers and is compatible with all soldering and ...