Bringing a modern PCB design together into reality is often the real test. The third part of this series offers practical ...

Preventing plating and soldering voids is about testing new manufacturing processes and analyzing the results. Plating and soldering voids usually have an identifiable cause, such as the type of ...

Today’s electronic packages have high clock speeds (multi-gigahertz range), fine pin densities (below 0.4-mm pitch), and high pin counts (over 2000). When assembled onto a printed-circuit board (PCB), ...