Devices deliver up to 25 Gbits/s over copper, and operate over both Infiniband and UTP cable The D-PHY 5GC/2.5GC physical-layer transceiver ICs allow designers to replace fiber optics with ...
Synopsys, Inc. (Nasdaq: SNPS) today announced that the silicon-proven DesignWare ® Bluetooth ® Low Energy Link Layer IP and PHY IP in industry-standard 40-nanometer (nm) and 55-nm processes have ...
Optimized for next-generation modules and system cards, the QT2022 10G bidirectional serial-to-XAUI PHY device consumes 900 mW while converting four 3.125-Gbit/s XAUI lanes into a serial 10.3 to 10.57 ...
PISCATAWAY, N.J.--(BUSINESS WIRE)--The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced that development ...
Chiplet PHY simulator addresses the effects of forward clocking with single-ended signaling and higher bit error rate on die-to-die interconnect performance of ...
MIPI interfaces play a strategic role in 5G mobile devices, connected car, and IoT solutions, defining three unique physical (PHY) layer specifications: MIPI D-PHY, M-PHY and C-PHY. MIPI D-PHY and ...
NI Announces FiRa-Validated Automated Test Tool for UWB PHY Layer Validation and Conformance Testing
AUSTIN, Texas--(BUSINESS WIRE)-- NI (NASDAQ: NATI), a trusted global leader in Semiconductor Test & Measurement, today announced validation by the FiRaTM Consortium of its UWB PHY test solution. NI’s ...
September 23, 2014. Tektronix has announced a complete PHY layer and conformance test solution for JEDEC LPDDR4, the next generation of mobile memory technology. Slated for adoption starting in 2015, ...
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