Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...

This is the fifth package of the second phase of the North Field Production Sustainability project, estimated to be valued at about $5bn, and mainly involves EPCI of two large gas compression ...

Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...

Like any successful system-on-chip (SoC) effort, a multi-die system-in-package (SiP) project must start with a sound system design. But then what? Are the steps in the SiP design flow different from ...

Concurrent design of a chip and its packaging environment is becoming more important than ever for several reasons. Designing a large, high power die, e.g. a System-on-Chip (SoC), without considering ...